LM32Dual Thermal Diode Temperature Sensor withSensorPath™BusGeneral DescriptionThe LM32 is a digital temperature sensor that measures 3temperature zon
1.0 Functional Description (Continued)Signal labels that begin with the label Slv_ depict the drive bythe LM32. All other signals show what would be s
1.0 Functional Description (Continued)1.3.2 Read TransactionDuring a read transaction, the master reads data from aregister at a specified address wit
1.0 Functional Description (Continued)•Data Bits This is the data written to the LM32 register,are driven by the master. Data is transferred serially
1.0 Functional Description (Continued)All devices (master or slave) must monitor the bus for anAttention Request signal. The following notes clarify t
2.0 Register Set2.1 REGISTER SET SUMMARYRegAddRegisterNameR/WPORValBit15MSbBit14Bit13Bit12Bit11Bit10Bit9Bit8Bit7Bit6Bit5Bit4Bit3Bit2Bit1Bit0LSb000 000
2.0 Register Set (Continued)Reg Add Register NameR/WPORValBit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1Bit 0LSb000 000 Device Number R 7h or 1hReservedAS2
2.0 Register Set (Continued)2.5 DEVICE ID (Addr: 000 010; 02h)RegAddRegisterNameR/WPORValBit15MSbBit14Bit13Bit12Bit11Bit10Bit9Bit8Bit7Bit6Bit5Bit4Bit3
2.0 Register Set (Continued)2.8 DEVICE CONTROL (Addr: 000 101; 05h)This register responds to a broadcast write command (Device Number 000). Write usin
2.0 Register Set (Continued)register clears also the Error Function 1 flag (ERF1). The Readout register contains the temperature data, and the sensor
2.0 Register Set (Continued)2.9.3 Temperature Data Readout (Addr: 001 001; 09h)RegAddRegisterNameR/WPORValBit15MSbBit14Bit13Bit12Bit11Bit10Bit9Bit8Bit
Connection DiagramTSSOP-1420071102Top ViewNational Package Number MTC14COrderNumberPackageMarkingNSPackageNumberTransportMediaLM32CIMT LM32CIMTMTC14C
2.0 Register Set (Continued)Temperature Data Format (Continued)Temperature Binary Hex- 40 ˚C 11 1011 0000 3B0h-255.5 ˚C 10 0000 0001 201h-256 ˚C 10 00
2.0 Register Set (Continued)Conversion Rate Control (Continued)LowPwr [CR1:CR0] Typical Conversion Rate (ms)001 911 01 3640 10 182 (default)1 10 7280
3.0 Application Hints (Continued)•q = 1.6x10−19Coulombs (the electron charge),•T = Absolute Temperature in Kelvin•k = 1.38x10−23joules/K (Boltzmann’s
3.0 Application Hints (Continued)4. Diode traces should be surrounded by a GND guard ringto either side, above and below if possible. This GNDguard sh
Physical Dimensions inches (millimeters)unless otherwise noted14-Lead Molded Thin Shrink Small Outline Package (TSSOP,JEDEC Registration Number MO-153
Block Diagram20071103LM32www.national.com3
Absolute Maximum Ratings(Notes 2, 1)Supply Voltage (V+) −0.5 V to 6.0 VVoltage at Any Digital Input orOutput Pin −0.5 V to 6.0 VVoltage on D1+ and D2+
SWD and ADD DIGITAL INPUT CHARACTERISTICSSymbol Parameter ConditionsTypical(Note 7)Limits(Note 8)Units(Limit)VIHSWD Logical High Input Voltage 2.1 V (
AC Electrical Characteristics (Continued)The following specification apply for V+ = +3.0 VDCto +3.6 VDC, unless otherwise specified. Boldface limits a
Timing Diagrams20071104FIGURE 1. Timing for Data Bits 0, 1 and Start Bit. See Section 1.2 "SensorPath BIT SIGNALING" for further details.LM3
Timing Diagrams (Continued)20071105FIGURE 2. Timing for Attention Request and Reset. See Section 1.2 "SensorPath BIT SIGNALING" for further
Typical Performance CharacteristicsRemote Diode Temperature Reading Sensitivity to DiodeFilter CapacitanceThermal Diode Capacitor or PCB Leakage Curre
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