
DS1859
Dual, Temperature-Controlled Resistors with
Internally Calibrated Monitors
____________________________________________________________________ 15
MEMORY
LOCATION
(hex)
EEPROM/
SRAM
R/W
DEFAULT
SETTING
(hex)
NAME OF LOCATION FUNCTION
68 to 69 SRAM R —
Measured MON3
(MSB to LSB)
Digitized measured value for MON3.
See Table 1.
6A to 6D SRAM — — Reserved —
6E SRAM — — Logic states —
Bit 7 — R X HIZSTA
Resistor status bit. A high indicates that both
resistors are in high-impedance mode. A low
indicates that both resistors are operating
normally.
6 — R/W 0 HIZCO
Resistor control bit. Setting this bit high
causes both resistors to go into a high-
impedance state.
5——X X —
4——X X —
2 — R X TXF
This status bit is high when OUT1 is high,
assuming there is an external pullup resistor
on OUT1.
3——X X —
1 — R X RXL
This status bit is high when OUT2 is high,
assuming there is an external pullup resistor
on OUT2.
0 — R X RDYB
This status bit goes high when V
CC
has fallen
below the POA level.
6F SRAM — — Conversion updates —
Bit 7 — R/W 0 TAU
This bit goes high after a temperature and
address update has occurred for the
corresponding measurement in bytes 60h to
61h. This bit can be written to a 0 by the user
and monitored to verify that a conversion has
occurred.
6 — R/W 0 V
CC
U
This bit goes high after a V
CC
update has
occurred for the corresponding measurement
in bytes 62h to 63h. This bit can be written to
a 0 by the user and monitored to verify that a
conversion has occurred.
5 — R/W 0 MON1U
This bit goes high after a MON1 update has
occurred for the corresponding measurement
in bytes 64h to 65h. This bit can be written to
a 0 by the user and monitored to verify that a
conversion has occurred.
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