Rainbow-electronics AT17F080 Manual do Utilizador descarregar pdf (Página 12)

12

AT17F040/080

3039C–CNFG–11/02

Notes: 1. For more information refer to the “Thermal Characteristics of Atmel’s Packages”, available on the Atmel web site, at

http://www.atmel.com/atmel/acrobat/doc0636.pdf.

2. Airflow = 0 ft/min.

Thermal Resistance Coefficients

(1)

Package Type AT17F040 AT17F080

8CN4 Leadless Array Package (LAP)

q

JC

[°C/W] –

q

JA

[°C/W]

(2)

–

20J Plastic Leaded Chip Carrier (PLCC)

q

JC

[°C/W] –

q

JA

[°C/W]

(2)

–

44A Thin Plastic Quad Flat Package (TQFP)

q

JC

[°C/W] – 17

q

JA

[°C/W]

(2)

–62

44J Plastic Leaded Chip Carrier (PLCC)

q

JC

[°C/W] – 15

q

JA

[°C/W]

(2)

–50

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