Rainbow-electronics MAX8709 Manual do Utilizador Página 2
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MAX8709
High-Efficiency CCFL Backlight
Controller with SMBus Interface
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(Circuit of Figure 1. V
BATT
= 12V, V
LOT
= V
REF
, V
CC
= V
DD,
V
SUS
= 5.3V, T
A
= 0°C to +85°C. Typical values are at T
A
= +25°C,
unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
BATT to GND..........................................................-0.3V to +30V
BST1, BST2 to GND ...............................................-0.3V to +36V
BST1 to LX1, BST2 to LX2........................................-0.3V to +6V
GH1 to LX1 ..............................................-0.3V to (V
BST1
+ 0.3V)
GH2 to LX2 ..............................................-0.3V to (V
BST2
+ 0.3V)
V
CC
, V
DD
to GND .....................................................-0.3V to +6V
REF, ILIM to GND .......................................-0.3V to (V
CC
+ 0.3V)
GL1, GL2 to GND .......................................-0.3V to (V
DD
+ 0.3V)
CCI, CCV, LOT to GND ............................................-0.3V to +6V
IFB, ISEC, VFB to GND................................................-6V to +6V
SDA, SCL, SUS to GND............................................-0.3V to +6V
PGND to GND .......................................................-0.3V to +0.3V
Continuous Power Dissipation (T
A
= +70°C)
28-Pin Thin QFN (derate 20.84mW/°C above +70°C) ..1667mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER CONDITIONS
MIN TYP MAX
UNITS
V
CC
= V
DD
= V
BATT
4.6 5.5
V
BATT
Input Voltage Range
V
CC
= V
DD
= open 5.5
28.0
V
V
BATT
= 28V 1.5 3
V
BATT
Quiescent Current V
SUS
= 5.5V
V
BATT
= V
CC
= 5V
3
mA
V
BATT
Quiescent Current, Shutdown SUS = GND 6 20 µA
V
CC
Output Voltage, Normal Operation
V
SUS
= 5.5V, 6V < V
BATT
< 28V,
0 < I
LOAD
< 20mA
5.0
5.35
5.5 V
V
CC
Output Voltage, Shutdown SUS = GND, no load 3.5 4.6 5.5 V
V
CC
rising (leaving lockout) 4.5
V
CC
Undervoltage-Lockout Threshold
V
CC
falling (entering lockout) 4.0
V
V
CC
Undervoltage-Lockout Hysteresis
200
mV
V
CC
Power-On Reset (POR) Threshold Rising edge
0.90 1.75 2.70
V
V
CC
POR Hysteresis 50 mV
REF Output Voltage, Normal Operation 4.5V < V
CC
< 5.5V, I
LOAD
= 40µA
1.96 2.00 2.04
V
GH1, GH2, GL1, GL2 On-Resistance I
TEST
= 100mA, V
CC
= V
DD
= 5.3V 9 18 Ω
GH1, GH2, GL1, GL2 Output Current 0.5 A
BST1, BST2 Leakage Current V
BST
_ = 12V, V
LX
_ = 7V 5 µA
Input Resonant Frequency Guaranteed by design 25
300
kHz
Minimum Off-Time
180 280 380
ns
Maximum Off-Time 18 28 38 µs
Current-Limit Threshold
LX1 - GND, LX2 - GND (Fixed)
ILIM = V
CC
180 200 220
mV
V
ILIM
= 0.5V 80
100 120
Current-Limit Threshold
LX1 - GND, LX2 - GND (Adjustable)
V
ILIM
= 2.0V
370 400 430
mV
Minimum Current Threshold
LX1 - GND, LX2 - GND
6mV
- General Description 1
- Applications 1
- Features 1
- Ordering Information 1
- Minimal Operating Circuit 1
- ABSOLUTE MAXIMUM RATINGS 2
- ELECTRICAL CHARACTERISTICS 2
- MAX8709 toc01 5
- MAX8709 toc02 5
- MAX8709 toc03 5
- LAMP-OUT VOLTAGE 6
- LIMITING AND TIMEOUT 6
- DPWM OPERATION (10%) 6
- Pin Description 8
- Pin Description (continued) 9
- Typical Operating Circuit 11
- Detailed Description 11
- Figure 3. Resonant Operation 12
- (CCI, CCV) 13
- Lamp Startup 14
- Feed-Forward Control and 14
- Dropout Operation 14
- DPWM Dimming Control 14
- DPWM SETTINGS 15
- SMBus Interface (SDA, SCL) 16
- Figure 8. SMBus Write Timing 17
- Figure 9. SMBus Read Timing 17
- Table 3. Commands Description 18
- Applications Information 19
- Component Selection 20
- Table 7. CCFL Specifications 21
- Chip Information 22
- Pin Configuration 22
- Package Information 23
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