MAX5927/MAX5929
Layout Considerations
To take full tracking advantage of the switch response
time to an output fault condition, it is important to keep all
traces as short as possible and to maximize the high-cur-
rent trace dimensions to reduce the effect of undesirable
parasitic inductance. Place the MAX5927/MAX5929 close
to the card’s connector. Use a ground plane to minimize
impedance and inductance. Minimize the current-sense
resistor trace length (<10mm), and ensure accurate cur-
rent sensing with Kelvin connections (Figure 13).
When the output is short circuited, the voltage drop
across the external MOSFET becomes large. Hence, the
power dissipation across the switch increases, as does
the die temperature. An efficient way to achieve good
power dissipation on a surface-mount package is to lay
out two copper pads directly under the MOSFET pack-
age on both sides of the board. Connect the two pads
to the ground plane through vias, and use enlarged
copper mounting pads on the topside of the board.
Low-Voltage, Quad, Hot-Swap
Controllers/Power Sequencers
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