MAX11043
4-Channel, 16-Bit, Simultaneous-Sampling ADCs
with PGA, Filter, and 8-/12-Bit Dual-Stage DAC
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
AVDD
= +3.0V to +3.6V, V
DVDD
= +3.0V, C
DVREG
= 10µF, V
AGND
= V
DGND
= 0, common-mode input voltage = AVDD/2, V
REFBP
=
V
REFA
= V
REFB
= V
REFC
= V
REFD
= +2.5V (external reference), V
REFDAC
= V
REFDACH
= +1.25V (external reference), V
REFDACL
= 0,
C
REFBP
= C
REFA
= C
REFB
= C
REFC
= C
REFD
= C
REFDAC
= 1µF, f
SCLK
= 38.4MHz, f
EXCLK
= 38.4MHz (external clock applied to
OSCIN), clock divider set to 4, SHDN = DACSTEP = UP/DWN = DGND, CONVRUN = DVDD, all analog inputs driven directly through
a series 150Ω/330pF anti-alias filter, PGA gain = 1. Default filters and gain settings. T
A
= T
MIN
to T
MAX
, unless otherwise noted (Note 1).
Typical values are at T
A
= +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDD to AGND ....................................................-0.3V to +4.0V
DVDD to DGND .....................................................-0.3V to +4.0V
DVREG to DGND...................................................-0.3V to +3.0V
AGND to DGND.....................................................-0.3V to +0.3V
Analog I/O, REFDACH, REFDACL, REFA, REFB, REFC, REFD,
AOUT, REFDAC, REFBP to AGND......-0.3V to (AVDD + 0.3V)
UP/DWN, CONVRUN, SHDN, DACSTEP, EOC, Digital I/O,
OSCIN, OSCOUT to DGND ....................-0.3V to (DVDD + 0.3V)
Maximum Current into Any Pin except AVDD, DVDD, DVREG,
AGND, DGND...............................................................±50mA
Continuous Power Dissipation (T
A
= +70°C)
TQFN Multilayer Board
(derate 37mW/°C above +70°C)................................2963mW
TQFN Single-Layer Board
(derate 26.3mW/°C above +70°C)..........................2105.3mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature......................................................+150°C
Storage Temperature Range ............................-65°C to +150°C
Lead Temperature (soldering, 10s) ................................+300°C
DYNAMIC PERFORMANCE (PGA Disabled, PGA Gain = 1 x (25kHz -1dB Full-Scale Signal))
(16 páginas)
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