281
8209A–AVR–08/09
ATmega16M1/32M1/64M1
the value of the Fuse High byte (FHB) will be loaded in the destination register as shown below.
Refer to Table 28-6 on page 292 for detailed description and mapping of the Fuse High byte.
When reading the Extended Fuse byte, load 0x0002 in the Z-pointer. When an LPM instruction
is executed within three cycles after the BLBSET and SPMEN bits are set in the SPMCSR, the
value of the Extended Fuse byte (EFB) will be loaded in the destination register as shown below.
Refer to Table 28-4 on page 290 for detailed description and mapping of the Extended Fuse
byte.
Fuse and Lock bits that are programmed, will be read as zero. Fuse and Lock bits that are
unprogrammed, will be read as one.
27.7.10 Reading the Signature Row from Software
To read the Signature Row from software, load the Z-pointer with the signature byte address
given in Table 27-5 on page 281 and set the SIGRD and SPMEN bits in SPMCSR. When an
LPM instruction is executed within three CPU cycles after the SIGRD and SPMEN bits are set in
SPMCSR, the signature byte value will be loaded in the destination register. The SIGRD and
SPMEN bits will auto-clear upon completion of reading the Signature Row Lock bits or if no LPM
instruction is executed within three CPU cycles. When SIGRD and SPMEN are cleared, LPM will
work as described in the Instruction set Manual.
Note: All other addresses are reserved for future use.
27.7.11 Preventing Flash Corruption
During periods of low V
CC
, the Flash program can be corrupted because the supply voltage is
too low for the CPU and the Flash to operate properly. These issues are the same as for board
level systems using the Flash, and the same design solutions should be applied.
A Flash program corruption can be caused by two situations when the voltage is too low. First, a
regular write sequence to the Flash requires a minimum voltage to operate correctly. Secondly,
the CPU itself can execute instructions incorrectly, if the supply voltage for executing instructions
is too low.
Flash corruption can easily be avoided by following these design recommendations (one is
sufficient):
Bit 76543210
Rd FHB7 FHB6 FHB5 FHB4 FHB3 FHB2 FHB1 FHB0
Bit 76543210
Rd – – – – EFB3 EFB2 EFB1 EFB0
Table 27-5. Signature Row Addressing
Signature Byte Z-Pointer Address
Device Signature Byte 1 0x0000
Device Signature Byte 2 0x0002
Device Signature Byte 3 0x0004
RC Oscillator Calibration Byte 0x0001
TSOFFSET Temp Sensor Offset 0x0003
TSGAIN Temp Sensor Gain 0x0005
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