Rainbow-electronics MAX2057 Manual do Utilizador descarregar pdf (Página 9)

MAX2057

1700MHz to 2500MHz Variable-Gain

Amplifier with Analog Gain Control

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Pin Description

PIN NAME FUNCTION

1, 3, 4, 6, 7,

9, 10, 12, 14,

18, 19,

21–24, 27,

28, 30, 31,

33, 34, 36

GND Ground. Connect to the board’s ground plane using low-inductance layout techniques.

2 OUT_A

Second-Attenuator Output. Internally matched to 50Ω over the operating frequency band. Connect to

IN through a DC-blocking capacitor if greater than 21dB of gain-control range is required. No

connection is required if the second attenuator is not used.

5, 13, 16, 25,

Power Supply. Bypass each pin to GND with capacitors as shown in the Typical Application Circuit.

Place capacitors as close to the pin as possible.

8 IN_A

Second-Attenuator Input. Internally matched to 50Ω over the operating frequency band. Connect to a

50Ω RF source through a DC-blocking capacitor if greater than 21dB of gain-control range is

required. No connection is required if the second attenuator is not used.

11 V

CNTL

Analog Gain-Control Input. Limit voltages applied to this pin to a 1V to 4.5V range when V

present to ensure device reliability.

15 R

SET1

First-Stage Amplifier Bias-Current Setting. Connect to GND through a 1.2kΩ resistor.

17 R

SET2

Second-Stage Amplifier Bias-Current Setting. Connect to GND through a 2kΩ resistor.

20 OUT

RF Output. Internally matched to 50Ω over the operating frequency band. Requires a DC-blocking

capacitor and a shunt-matching capacitor.

26 AMP_IN

Amplifier Input. Internally matched to 50Ω over the operating frequency band. Connect to ATTN_OUT

through a DC-blocking capacitor.

ATTN_OUT

Attenuator Output. Internally matched to 50Ω over the operating frequency band. Connect to AMP_IN

through a DC-blocking capacitor.

35 IN

RF Input. Internally matched to 50Ω over the operating frequency band. Connect to a 50Ω RF source

through a DC-blocking capacitor if the second attenuator is not used.

Exposed

Paddle

GND

Exposed Paddle Ground Plane. This paddle affects RF performance and provides heat dissipation.

This paddle MUST be soldered evenly to the board’s ground plane for proper operation.

1 2 3 4 5 6 7 8 9 10 11 12

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