MAX15031
80V, 300mW Boost Converter and Current
Monitor for APD Bias Applications
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
IN
= V
PWR
= 3.3V. V
SHDN
= 3.3V. C
IN
= C
PWR
= 10µF. C
CP
= 10nF, V
CNTRL
= V
IN
. V
RLIM
= 0. V
PGND
= V
SGND
= 0. V
BIAS
= 40V.
APD = unconnected. CLAMP = unconnected. ILIM = unconnected, MOUT = unconnected. T
A
= T
J
= -40°C to +125°C, unless other-
wise noted. Typical values are at T
A
= +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
PWR, IN to SGND ...................................................-0.3V to +12V
LX to PGND ............................................................-0.3V to +80V
BIAS, APD to SGND ...............................................-0.3V to +80V
SHDN to SGND............................................-0.3V to (V
IN
+ 0.3V)
CLAMP to SGND......................................-0.3V to (V
BIAS
+ 0.3V)
FB, ILIM, RLIM, CP, CN, CNTRL to SGND .............-0.3V to +12V
PGND to SGND .....................................................-0.3V to +0.3V
MOUT to SGND ....................................-0.3V to (V
CLAMP
+ 0.3V)
Continuous Power Dissipation
16-Pin TQFN (derate 25mW/°C above +70°C) ............2000mW
Thermal Resistance (Note 1)
θ
JA
....................................................................................40°C/W
θ
JC
......................................................................................6°C/W
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
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