Rainbow-electronics DS1747P Manual do Utilizador descarregar pdf (Página 16)

DS1747/DS1747P

16 of 18

DS1747P

PKG INCHES

DIM MIN NOM MAX

A 0.920 0.925 0.930

B 0.980 0.985 0.990

C - - 0.080

D 0.052 0.055 0.058

E 0.048 0.050 0.052

F 0.015 0.020 0.025

G 0.025 0.027 0.030

NOTE:

Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder

reflow oriented with the label side up (“live – bug”).

Hand Soldering and touch–up: Do not touch or apply the soldering iron to leads for more than 3 (three)

seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the part,

apply flux, heat the lead frame pad until the solder reflows and use a solder wick to remove solder.

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Rainbow-electronics DS1747P Manual do Utilizador Página 16