Rainbow-electronics MAX9135 Manual do Utilizador descarregar pdf (Página 2)

MAX9132/MAX9134/MAX9135

Programmable, High-Speed, Multiple

Input/Output LVDS Crossbar Switches

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

DC ELECTRICAL CHARACTERISTICS

AVDD

= V

DVDD

= V

LVDSVDD

= +3.0V to +3.6V, T

= -40°C to +105°C, unless otherwise noted. Typical values are at V

AVDD

= V

DVDD

= V

LVDSVDD

= +3.3V, T

= +25°C.) (Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

to GND...........................................................-0.3V to +4.0V

All Pins to GND .............................................-0.3V to V

+ 0.3V

Short-Circuit Duration (all outputs).............................Continuous

Continuous Power Dissipation (T

= +70°C)

32-Pin TQFP (derate 27.8mW/°C above +70°C)........2222mW

20-Pin TSSOP (derate 26.5mW/°C above +70°C) .....2122mW

Junction-to-Case Thermal Resistance (θ

) (Note 1)

32-Pin TQFP ...................................................................4°C/W

20-Pin TSSOP.................................................................2°C/W

Junction-to-Ambient Thermal Resistance (θ

) (Note 1)

32-Pin TQFP .................................................................36°C/W

20-Pin TSSOP............................................................37.7°C/W

Operating Temperature Range .........................-40°C to +105°C

Junction Temperature......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

ESD Protection

Human Body Model (R

= 1.5kΩ, C

= 100pF)

All Other Pins Including SCL, SDA to GND .................±2kV

IEC61000-4-2 (R

= 330Ω, C

= 150pF)

Contact Discharge

(DIN_, DOUT_) to GND ..............................................±10kV

Ai-Gap Discharge

(DIN_, DOUT_) to GND ..............................................±15kV

ISO10605 (R

= 2kΩ, C

= 330pF)

Contact Discharge

(DIN_, DOUT_) to GND ..............................................±10kV

Ai-Gap Discharge

(DIN_, DOUT_) to GND ..............................................±25kV

Lead Temperature (soldering, 10s) ................................+300°C

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Supply Voltage V

3.0 3.6 V

MAX9132 60 80

Supply Current

AVDD

DVDD

LVDSVDD

Outputs switching at

20MHz

MAX9134/MAX9135 86 100

SINGLE-ENDED CMOS INPUTS (PD, FS, RXD)

Input High Level V

IH1

2.0 V

Input Low Level V

IL1

0.8 V

Input High Current I

IN1

= 0 to V

-20 +20 µA

SINGLE-ENDED OUTPUTS (TXD, AS1/NSLP)

Output High Level V

0.4

Output Low Level V

= 4mA 0.4 V

3-LEVEL INPUTS (S5–S0, AS0, AS1)

Input High Level V

IH3

2.5 V

Input Low Level V

IL3

0.8 V

Input Open Level V

IO3

Measured at the input pins 1.2 1.45 1.9 V

Input Current I

, I

IL3

= 0 or V

IH3

= V

-20 +20 µA

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial

1 2 3 4 5 6 7 ... 18 19

MAX9132/MAX9134/MAX9135 1

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